Introduction of the “Integrated Microsystems” Project |
Prof. M. Esashi |
Tohoku Univ.
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Initial Stage Prototyping for the Hetero Integration |
Prof. S. Tanaka |
Tohoku Univ.
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Hands-on Access to Fabrication Facility |
Prof. K. Totsu |
Tohoku Univ.
|
Massive Parallel EB Exposure Systems |
Prof. M. Esashi |
Tohoku Univ.
|
Introduction of the “Research Center for Ubiquitous MEMS and Micro Engineering” |
Dr. R. Maeda |
AIST
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Production Stage Pprototyping for the Hetero Integration |
Dr. T. Kobayashi |
AIST
|
High Efficiency Integrated MEMS Production Technology |
Dr. H. Takagi |
AIST
|
MEMS Commercialization: Bridging the Gap from Prototype to Production |
Mr. P. Krishnan |
SVTC (USA)
|
Imec CMORE SiGe MEMS Technology Platform |
Dr. S. Donnay |
IMEC (Belgium)
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MEMS, Advanced Microsystems, and Their Integration in the Léti's Platforms |
Dr. A. Rouzaud |
LETI (France)
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Smart Systems Integration by Using Advanced MEMS Technologies |
Prof. T. Gessner |
Fraunhofer ENAS (Germany)
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MEMS for Biological Applications and Energy |
Prof. C. F. Pirri |
Torino Institute of Technology (Italy)
|
Wafer-Level Heterogeneous Integration Techniques for MEMS and IC |
Prof. G. Stemme |
Royal Institute of Technology KTH (Sweden)
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“Total Solution for MEMS Application” - Relations with Worldwide Nanotech Centers - |
Mr. S. Kaminaga |
Sumitomo Precision (Japan)
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“MEMS” OMRON Way |
Dr. Y. Sekiguchi |
OMRON (Japan)
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New Age of MEMS Large Wafer Scale Production |
Dr. K. Suzuki |
Dainippon Printing (Japan)
|
MEMS Process Integration and Volume Production |
Dr. J. Hsieh |
APM (Taiwan)
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Introduction of the “RFID/USN Center” and the MEMS in Korea |
Dr. K. K. Choi |
RFID/USN Center (Korea)
|