| Introduction of the “Integrated Microsystems” Project |
Prof. M. Esashi |
Tohoku Univ.
|
| Initial Stage Prototyping for the Hetero Integration |
Prof. S. Tanaka |
Tohoku Univ.
|
| Hands-on Access to Fabrication Facility |
Prof. K. Totsu |
Tohoku Univ.
|
| Massive Parallel EB Exposure Systems |
Prof. M. Esashi |
Tohoku Univ.
|
| Introduction of the “Research Center for Ubiquitous MEMS and Micro Engineering” |
Dr. R. Maeda |
AIST
|
| Production Stage Pprototyping for the Hetero Integration |
Dr. T. Kobayashi |
AIST
|
| High Efficiency Integrated MEMS Production Technology |
Dr. H. Takagi |
AIST
|
| MEMS Commercialization: Bridging the Gap from Prototype to Production |
Mr. P. Krishnan |
SVTC (USA)
|
| Imec CMORE SiGe MEMS Technology Platform |
Dr. S. Donnay |
IMEC (Belgium)
|
| MEMS, Advanced Microsystems, and Their Integration in the Léti's Platforms |
Dr. A. Rouzaud |
LETI (France)
|
| Smart Systems Integration by Using Advanced MEMS Technologies |
Prof. T. Gessner |
Fraunhofer ENAS (Germany)
|
| MEMS for Biological Applications and Energy |
Prof. C. F. Pirri |
Torino Institute of Technology (Italy)
|
| Wafer-Level Heterogeneous Integration Techniques for MEMS and IC |
Prof. G. Stemme |
Royal Institute of Technology KTH (Sweden)
|
| “Total Solution for MEMS Application” - Relations with Worldwide Nanotech Centers - |
Mr. S. Kaminaga |
Sumitomo Precision (Japan)
|
| “MEMS” OMRON Way |
Dr. Y. Sekiguchi |
OMRON (Japan)
|
| New Age of MEMS Large Wafer Scale Production |
Dr. K. Suzuki |
Dainippon Printing (Japan)
|
| MEMS Process Integration and Volume Production |
Dr. J. Hsieh |
APM (Taiwan)
|
| Introduction of the “RFID/USN Center” and the MEMS in Korea |
Dr. K. K. Choi |
RFID/USN Center (Korea)
|