{"id":555,"date":"2025-07-14T11:41:02","date_gmt":"2025-07-14T02:41:02","guid":{"rendered":"https:\/\/www.mu-sic.tohoku.ac.jp\/museum\/wp\/?p=555"},"modified":"2026-04-14T12:31:43","modified_gmt":"2026-04-14T03:31:43","slug":"sendai-mems-showroom","status":"publish","type":"post","link":"https:\/\/www.mu-sic.tohoku.ac.jp\/museum\/index.php\/2025\/07\/14\/sendai-mems-showroom\/","title":{"rendered":"Sendai MEMS Showroom"},"content":{"rendered":"\n

1\uff0eHistory<\/p>\n\n\n\n

Based on a cooperation contract signed in 2005 by City of Sendai and Fraunhofer-Gesellschaft, Germany, Sendai MEMS Show Room was opened at MEMS Core Co., Ltd. in Sendai in 2006. The Show Room had been operated by cooperation of MEMS Core, City of Sendai, Fraunhofer representative office Japan and Tohoku University.
Since 2010, Micro Integration Center, Tohoku University has operated Hands-on-access Facility at Jun-ichi Nishizawa Memorial Research Center. Over 80 companies have accessed the facility for their prototyping of MEMS and semiconductor devices. In order to make more engineers have chance to visit the Show Room, the Show Room was moved into Jun-ichi Nishizawa Memorial Research Center and renewed on May 16th, 2012.<\/p>\n\n\n\n

2\uff0eOutline
(1) Managing institutions : MEMS Park Consortium, City of Sendai, Fraunhofer-Gesellschaft representative office Japan, Tohoku University
(2) Place : 2nd floor, Jun-ichi Nishizawa Memorial Research Center, Tohoku University
(3) Area : 71.6 m2
(4) Opening : May 16th, 2012
(5) Features :
The renewed content includes a history of MEMS development and the trends at Tohoku University. Materials produced by other world-wide research institutions and local companies are also demonstrated. The visitor can feel a history of MEMS development in the world, and particularly understand a flow of industrialization of MEMS.
A screen has been installed in the showroom, allowing for small-scale seminars such as those hosted by the Micro Systems Integration Research Association.
Exhibition posters and description cards are available in both Japanese and English.<\/p>\n\n\n\n

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Please click on the item (PDF) you wish to view from the list of posters or cards.<\/p>\n\n\n\n

List of Posters<\/strong><\/p>\n\n\n\n

Download All Files Here >><\/a><\/p>\n\n\n\n

0 Sendai MEMS showroom<\/a><\/td>1 What is MEMS?<\/a><\/td><\/tr>
2 Optical MEMS and Micro\/Nano-Optics (Hane, Kanamori)<\/a><\/td>3 RF MEMS<\/a><\/td><\/tr>
4 Mechanical sensors<\/a><\/td>5 Micromachining and packaging<\/a><\/td><\/tr>
6 Nanomachining and ultra-high sensitive sensing (Ono)<\/a><\/td>7 PZT thin films for MEMS<\/a><\/td><\/tr>
8 Sensor network (Kuwano)<\/a><\/td>9 Micro sensors for medical monitoring (Matsuo, Esashi et al.)<\/a><\/td><\/tr>
10 Minimally invasive medical devices and health care devices (Haga)<\/a><\/td>11 Tactile sensor network<\/a><\/td><\/tr>
12 Heterogeneous integration of MEMS on LSI by transfer<\/a><\/td>13 Development of massive parallel EB exposure system<\/a><\/td><\/tr>
14 Power MEMS (Tanaka et al.)<\/a><\/td>15 MEMS for production, testing, environment and safety<\/a><\/td><\/tr>
16 Examples of MEMS industrialization by Tohoku Univ,-
industry collaboration<\/a><\/td>		17 Advantest, High-Frequency, Low power consumption
MEMS Relay<\/a><\/td><\/tr>
18 Fraunhofer institute (Germany)<\/a><\/td>19 Fraunhofer project center in Tohoku University<\/a><\/td><\/tr>
20 ICAN (International Contest of innovAtioN) (Totsu et al.)<\/a><\/td>21 MEMS park consortium<\/a><\/td><\/tr>
22 Open collaboration and\u03bcSIC<\/a><\/td>23 IMEC (Interuniversity Microelectronics Center) (Belgium)<\/a><\/td><\/tr>
24 Start-up companies related to \u03bcSIC<\/a><\/td>25 Activities of Nishizawa center space users<\/a><\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

List of Cards<\/strong><\/p>\n\n\n\n

Download All Cards from A1 to N4 Here >>>><\/a><\/p>\n\n\n\n

Card Index (A1 to N4 \u2013 Full List)<\/a><\/td><\/tr>
Download A1 to A14 Here >><\/a>
A1 Infrared sensor, imager
A2 Infrared sensor
A3 2 axis galvano optical scanner
A4 DMD (Digital Micromirror Device) (TI (Texas
Instruments) USA)
A5 Digital cinema using DMD (Digital Micromirror
Device)
A6 Optical encoder (NTT)
A7 Piezoelectric, thermal inkjet printer head
A8 Electrostatic inkjet printer head
A9 MEMS resonator
A10 MEMS resonator (disk, Lamb etc.)
A11 FBAR (Film Bulk Acoustic Resonator)
A12 SAW device on LSI
A13 Tunable SAW filter using variable capacitor
A14 SAW passive wireless sensor<\/td><\/tr>
Download B1 to B14 Here >><\/a>
B1 Piezoresistive pressure sensor
B2 Integrated capacitive pressure sensor
B3 Resonant pressure sensor (Yokogawa Electric Work)
B4 Capacitive vacuum sensor
B5 Capacitive vacuum sensor products
B6 MEMS microphone
B7 MEMS microphone wafer (Nisshinbo Micro Devices)
B8 MEMS microphone for humid environment
B9 Capacitive accelerometer for automobile
B10 Wafer of accelerometer by surface micromachining
(Analog Devices USA)
B11 Various accelerometers
B12 Integrated capacitive accelerometer
B13 3-axis accelerometer
B14 Electrostatically levitated rotational gyroscope<\/td><\/tr>
Download C1 to C14 Here >><\/a>
C1 Electromagnetically driven resonating gyroscope
C2 Silicon ring gyroscope
C3 Piezoelectric gyroscope
C4 Electrostatically driven capacitive sensing gyroscope
C5 Yaw rate, acceleration sensor
C6 Accelerometer and gyroscope for automobile and smartphone
C7 Patterning
C8 Etching (Deep RIE, XeF2 Etching, etc)
C9 Deposition
C10 Probe for scanning probe microscope (SPM)
C11 Near-field optical probe and bow-tie antenna
C12 Highly sensitive sensors using thin resonator
C13 Multi-probe data storage
C14 Electron source<\/td><\/tr>
Download D1 to D14 Here >><\/a>
D1 Electrode for biopotential recording
D2 Semiconductor ion sensor (ISFET)
D3 Catheter pH, CO2 sensor
D4 Intermittent sampling continuous blood gas monitor
D5 Application of ISFET to dentistry, oceanography and fish cultivation
D6 Micro ISFET and integrated micro probe
D7 Gas sensors
D8 Disposable chemical analysis chip
D9 Bio LSI and tactile sensor network (Special Coordination Funds for Promoting Science and Technology, Formation of Innovation Center for Fusion of Advanced Technologies)
D10 Catheter blood pressure sensor
D11 Active catheter
D12 Multi-link motion mechanism using shape memory alloy
D13 Imaging for minimal invasive medicine
D14 Implantable stimulator<\/td><\/tr>
Download E1 to E14 Here >><\/a>
E1 LIGA process
E2 Laser processes and stealth dicing
E3 Anodic bonding
E4 Anodically bondable LTCC with electrical Feedthrough (NiKKO)
E5 Bonding materials (WPI-AIMR, Fraunhofer ENAS \u2013 Tohoku University)
E6 Shared CMOS LSI wafer (Special Coordination Funds for Promoting Science and Technology, Formation of Innovation Center for Fusion of Advanced Technologies)
E7 Laser-erased wafer process
E8 Massive parallel electron beam write (Special Coordination Funds for Promoting Science and Technology, Formation of Innovation Center for Fusion of Advanced Technologies)
E9 Micro pump, micro valve and chemical analysis system for liquid
E10 Micro mixer and particle analysis (Hitachi)
E11 Flow sensor and mass-flow controller for gas
E12 Bakable micro valve and anticorrosive mass-flow controller
E13 Sensing in harsh environment
E14 Silicon carbide (SiC) mold for glass press-molding<\/td><\/tr>
Download F1 to F14 Here >><\/a>
F1 Small size gas turbine engine dynamo
F2 Si micro-turbine and thermoelectric generator
F3 SiC and PZT by lost-mold process, Si3N4 by
reaction sintering
F4 Micro fuel cell
F5 Micro fuel reformer
F6 Digital micro thruster (solid rocket engine array)
F7 Electrostatic micro motor, actuator
F8 Distributed electrostatic micro actuator
F9 Piezoelectric micro stage
F10 Lateral motion piezoelectric microactuator
F11 Tactile display and tactile imager
F12 Micro refrigeration system
F13 Thermal MEMS switch
F14 Electrostatic and piezoelectric MEMS switch<\/td><\/tr>
Download G1 to G4 Here >><\/a>
G1 Wavelength swept pulsed quantum cascade laser
(EC-QCL) (Hamamatsu Photonics K.K.)
G2 Optical melt pressure & temperature sensor (NAGANO KEIKI CO., LTD)
G3 Capacitive high sensitive differential pressure
sensor \u201cMANOSTAR\u201d (Yamamoto Electric Works Co. Ltd)
G4 10th anniversary of SEMI MEMS seminar<\/td><\/tr>
Download H1 to H7 Here >><\/a>
H1 Tohoku Univ. and Belgium IMEC (Interuniversity Micro Electronics Center)
H2 Poly-SiGe for MEMS sensor applications
H3 MEMS gyroscope on CMOSIC using poly-SiGe
H4 SiGe micro-mirror array on CMOS IC
H5 CMORE SiGeMEMS mluti project wafer
H6 Holographic displays
H7 MEMS for energy harvester & electronic noise<\/td><\/tr>
Download I1 to I2 Here >><\/a>
I1 Piezoelectric and electrostatic optical scanners
I2 Immunological analyzer of Helicobacter pylori\u2019surease<\/td><\/tr>
Download N1 to N4 Here >><\/a>
N1 Infrared array sensor (Panasonic Corp.)
N2 3D LSI (Honda research Institute Japan, Co Ltd)
N3 Remote control switch using energy harvester (EnOcean GmpH)
N4 Membrane switch array for electrophoresis display and oscillometric blood pressure monitor (E-paper, Tokyo Sanyo Electric Co. Ltd, Kazuo Senda)<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

<\/p>\n","protected":false},"excerpt":{"rendered":"

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