{"id":680,"date":"2025-10-03T01:05:57","date_gmt":"2025-10-02T16:05:57","guid":{"rendered":"https:\/\/www.mu-sic.tohoku.ac.jp\/?p=680"},"modified":"2025-11-28T13:59:25","modified_gmt":"2025-11-28T04:59:25","slug":"%e7%ac%ac16%e5%9b%9e%e3%83%95%e3%83%a9%e3%82%a6%e3%83%b3%e3%83%9b%e3%83%bc%e3%83%95%e3%82%a1%e3%83%bc%e3%82%b7%e3%83%b3%e3%83%9d%e3%82%b8%e3%82%a6%e3%83%a0%e9%96%8b%e5%82%ac%e3%81%ae%e3%81%8a%e7%9f%a5","status":"publish","type":"post","link":"https:\/\/www.mu-sic.tohoku.ac.jp\/?p=680","title":{"rendered":"\u7b2c16\u56de\u30d5\u30e9\u30a6\u30f3\u30db\u30fc\u30d5\u30a1\u30fc\u30b7\u30f3\u30dd\u30b8\u30a6\u30e0\u958b\u50ac\u306e\u304a\u77e5\u3089\u305b"},"content":{"rendered":"\n

\u30de\u30a4\u30af\u30ed\u30b7\u30b9\u30c6\u30e0\u878d\u5408\u7814\u7a76\u958b\u767a\u30bb\u30f3\u30bf\u30fc\uff08\u03bcSIC\uff09\u306f\u201c16th Fraunhofer Symposium in Sendai\u201d\u3092Fraunhofer Institute for Electronic Nano Systems (ENAS)\u3068\u5171\u50ac\u30672025\u5e7412\u670815\u65e5\u306b\u6771\u5317\u5927\u5b66\u7247\u5e73\u3055\u304f\u3089\u30db\u30fc\u30eb\u3067\u958b\u50ac\u3044\u305f\u3057\u307e\u3059\u3002
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\u6280\u8853\u5c55\u793a\u306e\u8a73\u7d30\u306f\u3053\u3061\u3089\u3078\u30fc\uff1etechonology exhibition 2025<\/a>
\u6280\u8853\u5c55\u793a\u306e\u7533\u3057\u8fbc\u307f\uff1aFraunhofer ENAS\u306eweb\u30b5\u30a4\u30c8\u3088\u308a\u51fa\u5c55\u767b\u9332\u3092\u3057\u3066\u304f\u3060\u3055\u3044\u3002
\u3000\u3000\u3000\u3000\u3000\u3000\u3000Registration Fraunhofer Symposium-exhibitor – Fraunhofer ENAS<\/a><\/p>\n\n\n\n

\u3010\u30b7\u30f3\u30dd\u30b8\u30a6\u30e0\u958b\u50ac\u6982\u8981\u3011
16th Fraunhofer Symposium in Sendai -Advancements in Sensor, Photonic and Semiconductor Technology and Systems-<\/strong>\u300016th Fraunhofer Symposium – Fraunhofer ENAS<\/a>
\u65e5\u6642\uff1a2025\u5e7412\u670815\u65e5\uff08\u6708\uff099:00\uff5e19:30
\u5834\u6240\uff1a\u6771\u5317\u5927\u5b66\u7247\u5e73\u3055\u304f\u3089\u30db\u30fc\u30eb 2F\u4f1a\u8b70\u5ba4
\u3000\u3000\u3000https:\/\/sites.google.com\/tohoku.ac.jp\/sakurahall<\/a>
\u53c2\u52a0\u8cbb\uff1a\u7121\u6599
\u53c2\u52a0\u7533\u8fbc\uff1aFraunhofer ENAS\u306eweb\u30b5\u30a4\u30c8\u3088\u308a\u53c2\u52a0\u767b\u9332\u3092\u3057\u3066\u304f\u3060\u3055\u3044\u3002
\u3000\u3000\u3000Registration Fraunhofer Symposium – Fraunhofer ENAS<\/a>
\u3000\u3000\u3000\u203b\u8a00\u8a9e\uff1aEnglish
\u30b9\u30b1\u30b8\u30e5\u30fc\u30eb\uff1a
(9:00 – 9:20) Greetings \/ Opening remarks
Fraunhofer, Tohoku University, SiIicon Saxony

(9:20 – 10:20) Keynotes
\u30fbProf. Shuji Tanaka (Tohoku University): MEMS Technology beyond MEMS
\u30fbInes Stolberg (Vistec Electron Beam GmbH): Variable Shaped E-Beam Lithography – The Swiss Army Knife of Advanced Nanopatterning!

(10:20 – 10:45) Break+Exhibition

(10:45 – 12:05) Session 1: Sensors and Integration \u3000
\u30fb Prof. Masanori Muroyama (Tohoku Institute of Technology): Versatile Applications of Sensor Platform LSIs: From MEMS-Based Robotic Tactile Networks to Human Motion Sensing in a Super-Aging Society
\u30fbDr. Manuela Jungh\u00e4hnel (Fraunhofer IZM-ASSID): Fluidic cooling for modular interposer architecture providing scalable heat removal, power delivery, and communication
\u30fbProf. Takehito Shimatsu (Tohoku University): Recent advances in atomic diffusion bonding: room temperature bonding of wafers using inorganic thin films
\u30fbFranz Tank (Fraunhofer ENAS): Optomechanical Inertial Sensors Based on Ring Resonators: Design Approaches and Technology

(12.05 – 12.35) Business matching pitches
Companies\/Institutes from Japan and Germany

(12.35 – 13.25) Lunch break, exhibition and business matchmaking

(13:25 – 13:35) Frank Boesenberg, Managing Director Silicon Saxony: Greeting Adress & Introduction of Silicon Saxony Hightech Network<\/p>\n\n\n\n

(13.35 – 14.55) Session 2: Digital twin, AI and testing
\u30fbDr. Jan Langer,Fraunhofer ENAS): Knowledge-Enhanced Process Modeling in CMP: A Case Study in Semiconductor Fabrication
\u30fbMr. Hiroyuki Saito (AIZOTH Inc.): Integrating Process Workflows in Semiconductors: Linking Process Models via Multi-Sigma\u00ae AI Chain Analysis
\u30fbDr. Alexander Wei\u00df (Fraunhofer ENAS): European Test and Reliability Center Chemnitz (ETRC): A unique ecosystem for chip industry
\u30fbTakatoshi Yoshino, Advantest Corporation: Test Challenges on Chiplets in The Era of Complexity

(14.55 – 15.20) Break and exhibition

(15.20 – 17.00) Session 3: Photonics and optical sensing
\u30fbDr. Ryoichiro Suzuki (Ricoh Co., Ltd.): Recent progress of VCSEL technology at RICOH: from Printing to 3D sensing
\u30fbMr. Yasuhiro Fujimura (OPTOWL Co., Ltd.): Recent Advances and Future Prospects of OPTOWL Microdevices: From Here, Greater Light
\u30fbProf. Thoralf Gebel (HZDR Helmholtz Center Dresden): Ion implantation technologies for applications in Quantum Photonics and Optoelectronics
\u30fbProf. Kentaro Iwami (Tokyo University of Agriculture and Technology): Dielectric Metasurfaces for Next-Generation Optical Devices and Systems

(17.00 – 17.30) Business matchmaking
Companies\/Institutes from Japan and Germany

(17.30 – 19.30) Dinner reception<\/p>\n\n\n\n

\u3010\u30d5\u30e9\u30a6\u30f3\u30db\u30fc\u30d5\u30a1\u30fc\u30b7\u30f3\u30dd\u30b8\u30a6\u30e0\u306b\u3064\u3044\u3066\u3011
\u30d5\u30e9\u30a6\u30f3\u30db\u30fc\u30d5\u30a1\u30fc\u30b7\u30f3\u30dd\u30b8\u30a6\u30e0\u306f2005\u5e7410\u670819\u65e5\u306bMEMS\u30d1\u30fc\u30af\u30b3\u30f3\u30bd\u30fc\u30b7\u30a2\u30e0\u8a2d\u7acb1\u5468\u5e74\u4e8b\u696d\u30fb\u4ed9\u53f0\u5e02\u56fd\u969b\u7d4c\u6e08\u30bb\u30df\u30ca\u30fc\u300c\u30d5\u30e9\u30a6\u30f3\u30db\u30fc\u30d5\u30a1\u30fc\u30b7\u30f3\u30dd\u30b8\u30a6\u30e0inSendai \uff5e\u4e16\u754c\u3092\u3064\u304b\u3080MEMS\u30d3\u30b8\u30cd\u30b9\uff5e\u300d\u3068\u3057\u3066\u7b2c1\u56de\u304c\u958b\u50ac\u3055\u308c\u3001\u305d\u306e\u5f8c\u306f\u30b3\u30ed\u30ca\u30d1\u30f3\u30c7\u30df\u30c3\u30af\u671f\u9593\u3092\u9664\u3044\u3066\u6bce\u5e74\u958b\u50ac\u3055\u308c\u3066\u304d\u307e\u3057\u305f\u3002\u305d\u306e\u9593\u3001
\u30fb\u4ed9\u53f0\u5e02\u3068\u30d5\u30e9\u30a6\u30f3\u30db\u30fc\u30d5\u30a1\u30fc\u7814\u7a76\u6a5f\u69cb\u3068\u304c\u5354\u529b\u5354\u5b9a\u7de0\u7d50\uff082005\u5e74\uff5e2016\u5e74\uff09
\u30fb\u201cFraunhofer Project Center for NEMS \/ MEMS devices and manufacturing technologies at Tohoku University\u201d (FPC) \u306e\u8a2d\u7acb\u3000\uff082011\u5e74\uff5e2021\u5e74\uff09
\u30fb\u6771\u5317\u5927\u5b66\u304c\u30b1\u30e0\u30cb\u30c3\u30c4\u5de5\u79d1\u5927\u5b66\u3068\u5b66\u8853\u4ea4\u6d41\u5354\u5b9a\u7de0\u7d50\uff082013\u5e74\uff09
\u30fb\u30de\u30a4\u30af\u30ed\u30b7\u30b9\u30c6\u30e0\u878d\u5408\u7814\u7a76\u30bb\u30f3\u30bf\u30fc\uff08\u03bcSIC\uff09\u3068Fraunhofer ENAS\u304c\u5354\u529b\u5354\u5b9a\u7de0\u7d50\uff082022\u5e74\uff5e\u7d99\u7d9a\u4e2d\uff09\u3068\u69d8\u3005\u306a\u4ea4\u6d41\u30fb\u9023\u643a\u304c\u884c\u308f\u308c\u3066\u304d\u307e\u3057\u305f\u3002<\/p>\n\n\n\n

\u3010\u672c\u4ef6\u304a\u554f\u5408\u305b\u3011
\u30de\u30a4\u30af\u30ed\u30b7\u30b9\u30c6\u30e0\u878d\u5408\u7814\u7a76\u958b\u767a\u30bb\u30f3\u30bf\u30fc \u5927\u9ad8\u525b\u4e00
E-mail: koichi.ohtaka.e8\u3000\u2190\u3000@tohoku.ac.jp\u3092\u3064\u306a\u3052\u3066\u304f\u3060\u3055\u3044\u3002
Tel. 022-229-4113<\/p>\n\n\n\n

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\u56f3\uff11\uff1a1st Fraunhofer Symposium in Sendai (2005)<\/p>\n\n\n\n

\u56f3\uff12\uff1a14th Fraunhofer Symposium in Sendai (2023)-Innovation of Semiconductor Research and Creation \u2013\u3000Technologies and Components for Heterogeneous System Integration<\/p>\n\n\n\n

\u56f33\uff1a15th Fraunhofer Symposiumu in Sendai (2024) Micro\/Nanotechnology, MedTec and Life Sciences: Shaping the Future \u2013 Miyagi-Germany Technology & Business Matching \u2013<\/p>\n","protected":false},"excerpt":{"rendered":"

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