東北大学マイクロシステム融合研究開発センターはFraunhofer ENAS（Fraunhofer Institute for Electronic Nano Systems）と共同で、11月21日（火）に東北大学片平さくらホールにおいて『14th Fraunhofer Symposium in Sendai – Innovation of Semiconductor Research and Creation – Technologies and Components for Heterogeneous System Integration』を開催致しました。コロナ禍のため4年ぶりの対面での開催でしたが、当日は晴天にも恵まれ参加者は99名でした。
シンポジウムはFraunhofer Japan代表の三木英哉氏と東北大学大野英男総長の挨拶から始まり午前中のKeynote Sessionでは東北大学からマイクロシステム融合研究開発センター長戸津健太郎教授、ENAS副所長Stefan Schulz教授が東北大学とENASとの連携の振り返りと今後の方向性について講演し、続いて東北大学工学研究科小野崇人教授,ケムニッツ工科大学Ulrich T. Schwarz教授から東北大学/ケムニッツ工科大学での学術連携の方向性についての講演がありました。
Micro System Integration Center, Tohoku University, in collaboration with Fraunhofer ENAS (Fraunhofer Institute for Electronic Nano Systems), held the 14th Fraunhofer Symposium in Sendai – Innovation of Semiconductor Research and Creation – Technologies and Components for Heterogeneous System Integration” at Katahira Sakura Hall, Tohoku University. The symposium was held in person for the first time in four years due to the corona disaster, but the day was blessed with clear skies and 99 participants.
The symposium started with opening remarks by Mr. Hideya Miki, Fraunhofer Japan Representative and Prof. Hideo Ohno, President of Tohoku University, followed by a Keynote Session in the morning featuring Prof. Kentaro Totsu, Director of Tohoku University Microsystem Integration Center, and Prof. Stefan Schulz, Deputy Director of Fraunhofer ENAS. It included a review of the collaboration between Tohoku University and ENAS and a discussion of future directions. Next, Professor Takahito Ono of Tohoku University’s Graduate School of Engineering and Professor Ulrich T. Schwarz of Chemnitz University of Technology gave a lecture on the direction of academic collaboration at Tohoku University/Chemnitz University of Technology.
In the afternoon, after lunch, there were sessions on fabrication, integration, and test/characterization of important technology areas related to semiconductors and microsystems, with talks on the latest research results.
The symposium was accompanied by a technical exhibition, where 14 companies exhibited and actively exchanged information during lunch and breaks.
After the symposium, a simple get-together was held in the lounge on the first floor of Sakura Hall, where participants enjoyed a relaxed atmosphere.
テーマ：– Innovation of Semiconductor Research and Creation – Technologies and Components for Heterogeneous System Integration
10:00 – 10:10 am Welcome and Opening Hideya Miki, Fraunhofer Japan Prof. Takafumi Aoki, Tohoku University
10:10 – 11:50 am Keynote Session Transfer of R&D to the Industry – Test and Reliability Center Prof. Harald Kuhn, Fraunhofer ENAS Open Collaboration for R&D and Human Resource Development Prof. Kentaro Totsu, Tohoku University Flexible Optical Waveguides and Microoptics for Medical Implants in the Context of Optogenetics Prof. Ulrich T. Schwarz, Chemnitz University of Technology Nanoengineered Micro/Nanosystems Prof. Takahito Ono, Tohoku University
11:50 am – 1:00 pm Lunch Break, Exhibition
1:00 – 2:00 pm Session “Fabrication” Innovation of Microsystems based on Wafer Bonding Technology Prof. Shuji Tanaka, Tohoku University Smart Sensor Systems for High-Temperature Application by Integration with a SiC CMOS Technology Michael Jank, Fraunhofer IISB Innovations in Wafer Bonding for the Fabrication of Smart Systems Dr. Maik Wiemer, Fraunhofer ENAS
2:00 – 2:30 pm Break, Exhibition
2:30 – 3:30 pm Session “Integration” Heterogeneous Integration Based on Room-Temperature Bonding for MEMS and Sensors Prof. Eiji Higurashi, Tohoku University Room Temperature Oxide-Free Direct Bonding for Next Level Heterogenous Integration Tobias Wernicke, EV Group Heterogeneous System Integration Approaches by a Silicon Foundry Stefan Ernst, X-FAB MEMS Foundry GmbH
3:30 – 4:00 pm Break, Exhibition
4:00 – 5:00 pm Session “Test” NanoTerasu; Next Generation SR Facility Building a New Range of Innovation Ecosystem Prof. Masaki Takata, Tohoku University N.N. Photonic Integrated Circuits for Testing Shunsuke Abe, Advantest Corporation
