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14th Fraunhofer Symposium in Sendai

Innovation of Semiconductor Research and Creation – Technologies and Components for Heterogeneous System Integration

日時:2023年11月21日(火)10時~19時 場所:東北大学片平さくらホール 参加費:無料





10:00 – 10:10 am
Welcome and Opening
Hideya Miki, Fraunhofer Japan
Prof. Takafumi Aoki, Tohoku University

10:10 – 11:50 am
Keynote Session
Transfer of R&D to the Industry – Test and Reliability Center
Prof. Harald Kuhn, Fraunhofer ENAS
Open Collaboration for R&D and Human Resource Development
Prof. Kentaro Totsu, Tohoku University
Flexible Optical Waveguides and Microoptics for Medical Implants in the Context of Optogenetics
Prof. Ulrich T. Schwarz, Chemnitz University of Technology
Nanoengineered Micro/Nanosystems
Prof. Takahito Ono, Tohoku University

11:50 am – 1:00 pm
Lunch Break, Exhibition

1:00 – 2:00 pm
Session “Fabrication”
Innovation of Microsystems based on Wafer Bonding Technology
Prof. Shuji Tanaka, Tohoku University
Smart Sensor Systems for High-Temperature Application by Integration with a SiC CMOS Technology
Michael Jank, Fraunhofer IISB
Innovations in Wafer Bonding for the Fabrication of Smart Systems
Dr. Maik Wiemer, Fraunhofer ENAS

2:00 – 2:30 pm
Break, Exhibition

2:30 – 3:30 pm
Session “Integration”
Heterogeneous Integration Based on Room-Temperature Bonding for MEMS and Sensors
Prof. Eiji Higurashi, Tohoku University
Room Temperature Oxide-Free Direct Bonding for Next Level Heterogenous Integration
Tobias Wernicke, EV Group
Heterogeneous System Integration Approaches by a Silicon Foundry
Stefan Ernst, X-FAB MEMS Foundry GmbH

3:30 – 4:00 pm
Break, Exhibition

4:00 – 5:00 pm
Session “Test”
NanoTerasu; Next Generation SR Facility Building a New Range of Innovation Ecosystem
Prof. Masaki Takata, Tohoku University
Photonic Integrated Circuits for Testing
Shunsuke Abe, Advantest Corporation

5:00 – 7:00 pm
Dinner Reception